Chip warpage and stress analysis in power modules of different substrate configurations
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Author Name : |
MOHAMMAD AHMAD FALAH GHARAIBEH |
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Title : |
Chip warpage and stress analysis in power modules of different substrate configurations |
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Journal : |
Soldering & Surface Mount Technology, |
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Year : |
2025 |
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Research Area :
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Solid Mechanics, Thermal Stresses, Silicon Chip
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Journal URL :
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